Tag «0.3mm»

Indium Corporation Announces New PoP Solder Paste

Indium9.91 is a no-clean solder paste designed for use inpackage-on-package (PoP) applications 0.3mm and larger. Its rheology optimizes both dipping and packageretention. Indium9.91: Eliminates defects due to packagewarping Provides excellent solderability Has a long pot life Provides consistent solder paste volumes Indium9.91 can be used with SAC305 and Sn63/Pb37 alloys. Indium Corporationis a premier materials …

For the Lovers of Fountain Pen & Ink …
Chawm Ganguly

A maverick, jaywalking through life. Communicated in three continents as a journalist and a spin doctor. Print, Television, PR, Photography, Production - has been there, done it all. Author of several books on Corporate Communications, Social Media, Conferencing. Currently focusing on helping Corporates bridge the Traditional-Social Media divide and installing GenX values in Millennial motherboards. For More Visit: www.chawmganguly.com
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Corporate Communications is one of the fastest growing specializations in world, as the faculty transforms from being just another marketing tool in the scabbard of the top management, to being the primary driver, in this, the age of information. Information is today sought (and delivered) in an Instant and the efficiency with which the Communication team reacts to such demands often spells the difference between the winners and the also-ran’s, making it one of the most revered power centers of the corporate world. Join me, as I unravel the mysteries. www.chawmganguly.com
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