Indium Corporation Product Specialist to Present at IMAPS Conference
Indium Corporation’s Maria Durham, Product Specialist – Semiconductor and Advanced Assembly Materials, will present at the International Microelectronics and Packaging Society (IMAPS) International Conference and Exhibition on Device Packaging in Scottsdale, Arizona on Tuesday, March 12. Durham’s presentation, Semiconductor Fluxes for Wafer Bumping in 3D Assembly, examines, both experimentally and with theoretical analysis, the spin-coating …