Indium Corporation Announces Void-Reducing Water-Soluble Solder Paste
Indium6.4 Water-Soluble Solder Paste’s flux chemistry minimizes voiding under QFN and BGA assemblies. A typical water-soluble solder paste has approximately 15-30 percent voiding; however, Indium6.4 consistently yields less than five percent. Indium6.4 provides: Fewer voids Smaller voids Good cleanability and reflow properties Exceptional response-to-pause printing Extended stencil life Exceptional slump resistance Indium6.4 is manufactured with …